Our own brand for molded and extruded EMI shielding gaskets in the form of cans, frames, tubes, sheets and components.
Director of Global Sales - Automotive
Our own brand for molded and extruded EMI shielding gaskets in the form of cans, frames, tubes, sheets and components.
Test Procedure | Unit | 8604 | 8630 | 8633 | 8641 | 8650 | 1540 | 8605 | 8642 | 8648 | 8651 | |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Elastomer base | Silicone | Silicone | Silicone | Silicone | Silicone | Silicone | Silicone | Silicone | Silicone | Silicone | ||
Conductive filler | Ag/Cu | Ag/Glass | Ag/Glass | Ni/C | Ag/Al | NA | Ag/Cu | Ni/C | Ni/C | Ag/Al | ||
Production process | Molding | Molding | Molding | Molding | Molding | Extrusion | Extrusion | Extrusion | Extrusion | Extrusion | ||
Shape | ||||||||||||
Hardness | ISO 7619 | Shore A | 55 | 70 | 55 | 55 | 50 | 50 | 78 | 80 | 80 | 80 |
Volume resistivity | Mil-DTL 83528C | m0hmcm | 3 | 2 | 9 | 30 | 7 | 2 | 17 | 6 | 4 | |
Flammability | UL94 | V1 | V1 | V0 | V0 | V0 | V1 | |||||
Material safety datasheets | Ag_Cu | Ag_Glass | Ag_Glass | Ni_C | Ag_Al | Rubber | Ag_Cu | Ni_C | Ni_C | Ag_Al |
The Compashield SMT Pad is used as a grounding contact on printed circuit boards commonly used in the electronics industry and anywhere high electrical conductivity is needed in a compressible, resilient form, e.g. (mobile phones, base-stations, power amplifiers, laptop computers, PDAs, cameras & radar systems, infotainment systems, etc.).
The flexible and easily compressible SMT Pad can take up tolerances and close the gap between a PCB and another component, in addition to providing a reliable grounding contact.
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