Standard products
In the world of electronics and mechanical engineering, managing heat effectively is crucial for reliability and performance.
Compatherm Paste, a thermally conductive paste, provides thermal conductivity, bridging the gap between components and cooling solutions to ensure devices operate within safe temperature limits.
COMPATHERM® PASTE
Falling into the thin-bond-line category of Thermal Interface Materials (TIMs), it is engineered to form the thinnest possible film between the heat source and the heat sink. This minimal thermal resistance is key to its effectiveness. The high thermal conductivity of the paste ensures efficient heat dissipation, crucial for maintaining the integrity and longevity of electronic components.
Maximizes heat dissipation with minimal thermal resistance, leveraging an ultra-thin bond line for superior thermal management in high-power devices.
Facilitates easy application via dispensing or silk/stencil screen printing, ensuring consistent, high-quality thermal interface across various manufacturing processes.
Maintains consistent thermal conductivity and performance over time, with a stable composition that resists drying out, ensuring long-term reliability.
| Test standard | Unit | 9532 | 9543 | 9550 | |
|---|---|---|---|---|---|
| Base matrix | Silicone | Silicone | Silicone | ||
| Thermally conductive filler | Ceramic | Ceramic, Al | Ceramic, AI | ||
| Color | Visual | White | Gray | Gray | |
| Thermal Conductivity | ISO 22007-2 mod | W/(m-K) | 2.5 | 4.3 | 5 |
| Thermal Resistance @40 psi | ASTM D5470 | °C∙cm2/W | 0.3 | 0.06 | 0.05 |
| Viscosity | Brookfield 10rpm | cP | 110,000 | 250,000 | 200,000 |
| Density | ASTM D792 | g/cm^3 | 2.68 | 2.3 | 2.2 |
| Dielectric Breakdown Voltage | ASTM D149 | VAC/mm | 4 000 | 400 | 1 000 |
| Volatile Content | ASTM E595 (mod.) | % | 0.3 | 0.3 | 0.15 |
| BLT (Bond Line Thickness) | um | 50 | 20 | 20 | |
| Shelf life | month | 12 | 12 | 12 |
