Discuss your Trishield application with Nolato
We can help assess gasket design, material options and production requirements.

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Nolato provides Trishield form-in-place (FIP) gasket dispensing for electronic components, with material options for EMI shielding and IP sealing.
Trishield® Form-in-Place (FIP) gaskets provide EMI shielding for demanding electronics applications. Their triangular profile and low compression force help accommodate tolerances while supporting reliable electrical contact and integration into automated production. The wider Trishield portfolio also includes Trishield IP Sealing and Trishield RTV adhesive for bonding and electrical connection. Nolato supports customers with gasket design, material selection and dispensing.
We support gasket design in relation to the component geometry, available space and application requirements.
We help identify a suitable option from the available Trishield material variants based on the requirements of the application.
Dual-head dispensing supports automated production of Trishield EMI gaskets.


We can help assess gasket design, material options and production requirements.

EMI Shielding FIP Gaskets
Trishield IP Sealing
Designed for electronic applications requiring reliable environmental sealing in space-constrained designs, Trishield IP Sealing has a triangular profile with a high height-to-width ratio. This supports efficient sealing while maintaining low compression force requirements.
Trishield RTV Adhesive
Trishield RTV is a metal-filled silicone adhesive for bonding and electrical connection. It can be shaped into a narrow profile using the Trishield forming unit to help reduce material use.
FIP stands for form-in-place. The gasket is dispensed directly onto a component and formed in place.
The optimized triangular profile has a narrow footprint that helps reduce material use and associated material costs.
It contacts the PCB and accommodates tolerances to close gaps between the board and shielded housing.
It is designed for reliable environmental sealing in space-constrained electronic applications. Its triangular profile has a high height-to-width ratio and supports low compression force requirements.
Trishield RTV is an adhesive for bonding and electrical connection.
Use the material matrix and linked datasheets for the EMC variants it covers. Refer to the relevant technical information for IP Sealing and RTV.