Discover advanced heat management with our dispensable thermal filler, tailored for easy integration in complex electronics and high-volume production.
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Jonas Carlsson
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+46 708 12 99 95
STANDARD PRODUCT
Compatherm®: Thermal Gap Filler
Our Thermal gap filler enhances thermal conductivity and heat dissipation, ensuring device reliability and performance, making it ideal for a variety of applications.
Compatherm® Filler
Advanced Thermal Conductive Gap Filler for Heat Management
Our thermal gap filler is made using high-quality materials and developed to meet a growing need for reliable, cost-effective thermal solutions in high-tech industrial applications. Compatherm thermal filler is a liquid-dispensed thermal filler that can seamlessly conform to any arbitrary geometry and provide negligible component strain while being highly adaptable to high-volume production.
Advantages of Compatherm® Thermal Gap Filler
Optimal heat management
Combines thermal conductivity and low thermal resistance to ensure efficient heat dissipation, maintaining ideal operating temperatures for electronic components.
Adaptable application of thermal fillers
Features high conformability and minimal component stress, easily filling gaps of any shape at low pressure to facilitate perfect thermal contact without damaging sensitive parts.
Precision and efficiency
Offers precision tolerance compensation and supports seamless integration with automated dispensing systems, ensuring consistent thermal performance and efficient, large-scale application.
Cost-effective for high volume
Provides an economical solution for high-volume applications, allowing for the cost-effective deployment of thermal gap fillers without compromising quality.
Customized thermal solutions
Delivers customizable solutions, tailored to meet unique thermal management challenges across a variety of applications, ensuring optimal fit and performance.
compatherm® FILLER material matrix & datasheet
| Test standard | Unit | 9263 | 9290 | |
|---|---|---|---|---|
| Base matrix | Silicone 1-part | Silicone 1-part | ||
| Thermally conductive filler | Ceramic | Ceramic | ||
| Color | Visual | Pink | Purple/Green | |
| Cure time @25°C | h | n/a | n/a | |
| Thermal Conductivity | ISO 22007-2 mod | W/(m-K) | 6 | 9 |
| Flowrate | 3.2mm nozzle @ 90 PSI | g/min | 39 | 26 |
| Density | ASTM D792 | g/cm3 | 3.3 | 3.16 |
| Outgassing, TML | ASTM E595 Modified | % | 0.1 | 0.08 |
| Dielectric Breakdown Voltage | ASTM D149 | VAC/mm | 6 000 | 6 000 |
| Test standard | Unit | 9343 | 9344 | 9360 | |
|---|---|---|---|---|---|
| Base matrix | Silicone 2-part | Silicone 2-part | Silicone 2-part | ||
| Thermally conductive filler | Ceramic | Ceramic | Ceramic | ||
| Color part A | Visual | White | White | White | |
| Color, part B | Visual | Pink | Geen/Pink | Green | |
| Pot life @25°C | h | 4 | 2.5 | 3 | |
| Cure time @25°C | h | 24 | 20 | 16 | |
| Thermal Conductivity | ISO 22007-2 mod | W/(m-K) | 4 | 4 | 6 |
| Viscosity (mixed) | Brookfield 20rpm | Pa-s | 350 | 300 | 1700* |
| Flow Rate | 2mm nozzle @ 50 PSI | g/min | 28 | 36 | 30 |
| Hardness | ASTM D2240 | Shore 00 | 70 | 40 | 70 |
| Density | ASTM D792 | g/cm3 | 3.1 | 3.1 | 3.1 |
| Volume Resistivity | ASTM D257 | Ω·cm | 9.4·10^12 | 2.2·10^14 | 3.09·10^14 |
| Dielectric Breakdown Voltage | ASTM D149 | VAC/mm | 5 000 | 8 000 | 10 000 |
| Dielectric Constand @ 1MHZ | ASTM D150 | 1.15 | 8.31 | 8.677 | |
| Outgassing, TML | ASTM E595 Modified | % | 0.1 | 0.1 | 0.14 |
| Flammability | UL94 (file: E483565) | % | V-0 |
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