Connected vehicles and the challenge of secure data transmission

Automotive engineers face a range of design challenges and sometimes encounter problems of electromagnetic interference (EMI), which can be difficult to solve to achieve electromagnetic compatibility – EMC. 

The causes of electromagnetic interference are numerous and include both man-made and natural sources. The effects can range from temporary disturbances and data losses to system failure and even loss of life.

Every new car will be connected

It is widely predicted that, by 2025, almost every new car will be ‘connected’, and connection to the cloud will be standard. 

Connected vehicles will ‘talk’ to each other and to the road they’re on. This is useful in emergency situations, to avoid an accident. In the near future, everything will be connected; cars, roads, stop lights, etc. This presents a major challenge in designing networks that can deliver and process unprecedented and ever-increasing volumes of data. Technical developments have turned automotive systems into complex electrical and radio frequency (RF) devices. 

Risk of interference

Fully electric powertrains and the development of vehicle autonomy increase the need for active electrical components, complex interconnected systems and the use of RF systems, so it’s important for industry professionals to keep up to date with changes in the automotive industry. These changes can be viewed as either threats or opportunities.

This automotive transformation will affect car manufacturers and suppliers around the world, with the use of radar and sensors increasing the complexity of RF cosite interference analysis. Automotive engineers must consider the susceptibility of systems that directly control the vehicle and require high levels of safety assurance. 

The Form-In-Place EMC dispensing technology is a popular choice in the telecommunications and automotive industry for its unique properties, as it benefits both manufacturers and end-users. The design is being continually improved to stay one step ahead of the growing needs in this rapidly evolving application area.

Grounding and shielding

Grounding and shielding products ensure electrical performance without deteriorating under mechanical or environmental stress over the product lifetime.

For example, Compashield SMT Pad ensures reliable grounding performance for electronic applications. The pads are delivered in tape and reel packaging for automated placement and soldering reflow using standard SMT equipment. 

The Compashield SMT Pad is used as a grounding contact on printed circuit boards commonly used in the electronics industry and anywhere high electrical conductivity is needed in a compressible, resilient form, such as in camera and radar systems and infotainment systems.

Compashield SMT Pad ensures reliable grounding performance for electronic applications.