Unlock superior heat management with our thermally conductive silicone pads, engineered for efficient heat transfer in a wide range of electronic applications.
Contact us
Sending Email...
Contact person/s
Jonas Carlsson
Director Global Sales
+46 708 12 99 95
STANDARD PRODUCT
Compatherm Pad® : Thermal Heating Pads
These pads, designed to enhance cooling in devices provide an effective thermal interface that minimizes thermal resistance and maximizes heat dissipation, ensuring your electronics perform reliably at optimal temperatures.
Compatherm® Pad
Silicone Thermal Pads for Effective Heat Management
Our selection of silicone thermal pads uses high-quality materials designed to meet the most rigorous application requirements. These soft, thermally conductive silicone pads can be used where heat needs to be conducted between a component and a heat-dissipating surface, without any additional stress, or to bridge a gap for increased heat dispersion. Compatherm pads are available in a wide range of thicknesses, mechanical properties, liner solutions, and thermal performance.
Features of Compatherm® Thermal Pads
Superior heat conductivity
Achieve excellent thermal transfer with our silicone thermal pads, ensuring components stay cool under intense operations, enhancing device longevity and reliability.
Stress-free application
Soft and adaptable, these pads conform to surfaces at low pressure, ensuring a perfect fit for delicate electronics without risking damage during installation.
Versatile options
Choose the perfect fit from our selection, ranging from thermal conductive pads to specialized silicone thermal pads, catering to a wide variety of cooling needs.
Cost-effectiveness
Enjoy high-performance cooling solutions at competitive prices, allowing for efficient heat management without breaking the bank.
Tailored solutions
Leverage our customization options to meet specific thermal management challenges, offering personalized solutions that perfectly match your requirements.
Matrix and downloads
Compatherm® Pad Standard material matrix
| Test standard | Unit | 9410 | 9420 | 9421 | 9423 | 9430 | 9431 | 9434 | 9440 | |
|---|---|---|---|---|---|---|---|---|---|---|
| Base matrix | Silicone | Silicone | Silicone | Silicone | Silicone | Silicone |
Silicone | Silicone | ||
| Thermally conductive filler | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | ||
| Color | Visual | Pink | Lt Blue | Pink | Pink | Grey | Blue | Blue | Green | |
| Thickness Range | ASTM D374 | mm | 0.25-5.00 | 0.25-5.00 | 0.50-5.00 | 0.50-5.00 | 0.25-5.00 | 0.25-5.00 | 0.25-5.00 | 1.00-5.00 |
| Thermal Conductivity | ISO 22007-2 mod | W/(m-K) | 1 | 2 | 2.5 | 2.5 | 3 | 3 | 3 | 4 |
| Hardness | ASTM D2240 | Shore 00 | 40 | 40 | 40 | 60 | 60 | 40 | 40 | 40 |
| Density | ASTM D792 | g/cm^3 | 2.07 | 2.73 | 2.70 | 2.70 | 2.65 | 3.10 | 3.00 | 3.10 |
| Volume Resistivity | ASTM D257 | Ω·cm | 2.5x1013 | 3.5x1012 | 8.5x1012 | 1.5x1014 | 2.1x1013 |
4.7x1014 |
3.4x1010 | 4.0x1012 |
| Dielectric Breakdown Voltage | ASTM D149 | VAC/mm | 5 000 | 5 000 | 5 000 | 5 000 | 500 | 8 000 | 8 000 | 8 000 |
| Dielectric constant @ 1MHZ | ASTM D150 | 6.33 | 6.33 | 7.47 | 7.09 | 22.8 | 7.43 | 5.66 | 7.90 | |
| Outgassing, TML | ASTM E596 Modified | % | 0.61 | 0.06 | 0.13 | 0.13 | 0.06 | 0.04 | 0.10 | 0.10 |
| Flammability | UL94 (file: E483565) | V-0 | V-0 | V-0 | V-0 |
| Test standard | Unit | 9450 | 9453 | 9460 | 9470 | 9471 | 9474 | 9480 | |
|---|---|---|---|---|---|---|---|---|---|
| Base matrix | Silicone | Silicone | Silicone | Silicone | Silicone | Silicone | Silicone | ||
| Thermally conductive filler | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | ||
| Color | Visual | Grey | Grey | Lt Blue | Lt Grey | Pink | Blue | Blue | |
| Thickness Range | ASTM D374 | mm | 0.50-5.00 | 1.00-5.00 | 0.70-5.0 | 1.00-5.00 | 1.00-5.00 | 1.00-5.00 | 0.50-5.00 |
| Thermal Conductivity | ISO 22007-2 mod | W/(m-K) | 5 | 5 | 6 | 7 | 7 | 7.5 | 8 |
| Hardness | ASTM D2240 | Shore 00 | 40 | 30 | 60 | 40 | 40 | 40 | 40 |
| Density | ASTM D792 | g/cm^3 | 3.10 | 3.16 | 3.24 | 2.55 | 3.10 | 3.30 | 3.10 |
| Volume Resistivity | ASTM D257 | Ω·cm | 3.2x1014 |
4.3x1012 | 5.32x1013 | 6.7x1012 | 3.1x1012 | 3.57x1011 |
1.0x1013 |
| Dielectric Breakdown Voltage | ASTM D149 | VAC/mm | 7 000 | 10 000 | 10 000 | 1 500 | 8 000 | 10 000 | 8 000 |
| Dielectric constant @ 1MHZ | ASTM D150 | 7.57 | 6.3 | 14.5 | 26.4 | 7.68 | 13.71 | 7.7 | |
| Outgassing, TML | ASTM E596 Modified | % | 0.04 | 0.2 | 0.13 | 0.23 | 0.3 | 0.1 | 0.3 |
| Flammability | UL94 (file: E483565) | V-0 | V-0 | V-0 |
Compatherm® Pad Soft material matrix
| Test standard | Unit | 9422 | 9433 | 9451 | 9472 | 9473 | 9475 | |
| Base matrix | Silicone | Silicone | Silicone | Silicone | Silicone |
Silicone | ||
| Thermally conductive filler | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | ||
| Color | Visual | Lt Blue/Lt Yellow | Grey | Grey | Lt Grey | Pink | Grey | |
| Thickness Range | ASTM D374 | mm | 0.50-5.00 | 0.50-5.00 | 0.50-5.00 | 1.00-5.00 | 1.00-5.00 | 1.00-5.00 |
| Thermal Conductivity | ISO 22007-2 mod | W/(m-K) | 2 | 3 | 5 | 7 | 7 | 7.5 |
| Hardness | ASTM D2240 | Shore 00 | 25 | 28 | 28 | 20 | 20 | 20 |
| Density | ASTM D792 | g/cm^3 | 2.73 | 2.65 | 3.07 | 2.55 | 3.10 | 3.10 |
| Volume Resistivity | ASTM D257 | Ω·cm | 8.4x1014 | 2.1x1013 | 3.2x1014 | 6.7x1012 |
3.1x1012 |
10.3x1011 |
| Dielectric Breakdown Voltage | ASTM D149 | VAC/mm | 5 000 | 500 | 5 000 | 1 500 | 8 000 | 7 000 |
| Dielectric constant @ 1MHZ | ASTM D150 | 7.07 | 22.8 | 7.57 | 26.4 | 7.68 | 5.79 | |
| Outgassing, TML | ASTM E596 Modified | % | 0.1 | 0.06 | 0.04 | 0.23 | 0.3 | 0.31 |
| Flammability | UL94 (file: E483565) | V-0 | V-0 | V-0 | V-0 |
Compatherm® Pad Ultra-Soft material matrix
| Test standard | Unit | 9411 | 9432 | 9441 | 9470s | 9612 | |
| Base matrix | Silicone | Silicone | Silicone | Silicone | Silicone |
||
| Thermally conductive filler | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | ||
| Color | Visual | Lt Blue | Brown | Green | Lt Grey | Lt Purple | |
| Thickness Range | ASTM D374 | mm | 0.50-5.00 | 1.00-5.00 | 1.00-5.00 | 1.00-5.00 | 1.00-5.00 |
| Thermal Conductivity | ISO 22007-2 mod | W/(m-K) | 1.2 | 3 | 4 | 7 | 12 |
| Hardness | ASTM D2240 | Shore 00 | 9 | 10 | 8 | 15 | 25 |
| Density | ASTM D792 | g/cm^3 | 2.10 | 2.92 | 3.10 | 2.55 | 2.86 |
| Volume Resistivity | ASTM D257 | Ω·cm | 1.7x1013 | 2.1x1015 | 4.0x1012 | 6.7x1012 |
1.88x1012 |
| Dielectric Breakdown Voltage | ASTM D149 | VAC/mm | 8 000 | 7 000 | 8 000 | 1 500 | 10 000 |
| Dielectric constant @ 1MHZ | ASTM D150 | 6.62 | 5.48 | 7.90 | 26.4 | 11.58 | |
| Outgassing, TML | ASTM E596 Modified | % | 0.59 | 0.05 | 0.10 | 0.58 | 0.31 |
| Flammability | UL94 (file: E483565) | V-0 |
Compatherm® Pad Non-Insulating material matrix
| Test standard | Unit | 9610 | 9611 | |
| Base matrix | Silicone | Silicone | ||
| Thermally conductive filler | Carbon | Carbon | ||
| Color | Visual | Dk Grey | Dk Grey | |
| Thickness Range | ASTM D374 | mm | 1.00-5.00 | 1.00-5.00 |
| Thermal Conductivity | ISO 22007-2 mod | W/(m-K) | 14 | 16 |
| Hardness | ASTM D2240 | Shore 00 | 45 | 40 |
| Density | ASTM D792 | g/cm^3 | 2.70 | 2.76 |
| Volume Resistivity | ASTM D257 | Ω·cm | 500 | 500 |
| Dielectric Breakdown Voltage | ASTM D149 | VAC/mm | n/a | n/a |
| Dielectric constant @ 1MHZ | ASTM D150 | n/a | n/a | |
| Outgassing, TML | ASTM E596 Modified | % | 0.4 | 0.2 |
| Flammability | UL94 (file: E483565) |
You might also be interested in
STORIES
New silicone material for efficient heat dissipation
Thermal management is a hot topic. How do you efficiently divert the heat generated by electronic components to ensure they’re not damaged?
STANDARD PRODUCT
Thermal Interface Materials
Our thermal interface material (TIM) portfolio and our leading expertise in this field provide you with support and solutions for optimal efficiency and cost savings in electronics cooling. We have the know-how and resources to guide you throughout the thermal interface material process.
STORIES
Cool running with silicone-based thermal interface material
Some issues have been raised regarding silicone in electronics. Consequently, in spite of their often-disadvantageous aging, thermal stability, and stiffness properties, PLP TIM products with non-silicone-based matrices have been gaining in popularity. This article by the R&D department of Nolato Silikonteknik addresses these concerns and underlines the benefits offered by silicone: